HDMI standards continue to evolve to deliver high quality video and audio. With each successive generation, HDMI source developers face faster data rates and new test challenges. HDMI 2.1 increases data rates up to 48 Gbps (Giga bits per second) over 4 lanes, expanding test cases and test times. Differential, eye diagram and single-ended measurements require high signal integrity with the lowest noise to accurately measure device performance.

Enhanced Audio Return Channel (eARC) is a new feature in HDMI 2.1, which simplifies audio connectivity and supports the most advanced audio formats and highest audio quality. eARC improves the differential audio information over single ended signaling and utilizes the IEC61937 specification. To test for eARC compliance, developers need an affordable, easy-to-use, comprehensive and fast measurement solution.

DisplayPort (DP) is a newer standard originally developed to support the higher performance and flexibility requirements of personal computers. In addition to higher performance, it also provides a more robust and error-free digital A/V link. Since DisplayPort is packet based and leverages the signaling technology common in other modern high-speed data interfaces, it can be combined with other standards such as USB and Thunderboltâ„¢.

Tektronix offers test solutions for HDMI, eARC, DisplayPort as well as the new USB Type-C. We will discuss the various challenges in testing these interfaces and introduce tools to help you perform the electrical compliance test.

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Presenter

Tan Ai Heong

Tan Ai Heong

Regional Application Engineer

As Regional Application Engineer, Ai-Heong is responsible for the high speed communication applications and products. Ai Heong was previously a Signal Integrity Engineer with Intel, with working expertise in IBIS modeling, timing simulation & analysis and product electrical validation.

Ai Heong received his Bachelor degree in Mechatronic from University Technology Malaysia. He then continued to earn his Master Degree with Honours from University Science Malaysia. His Thesis in signal integrity simulation and modeling for IC package via TSV process was published in the international conferences.